Author Correction: Record thermopower found in an IrMn-based spintronic stack.
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Tu S
Fert Beijing Institute, BDBC, School of Microelectronics, Beihang University, 100191, Beijing, China.
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Ziman T
Institut Laue-Langevin, 38042, Grenoble, France.
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Yu G
Department of Electrical Engineering, University of California, Los Angeles, CA, 90095, USA.
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Wan C
Beijing National Laboratory for Condensed Matter Physics, Institute of Physics, University of Chinese Academy of Sciences, Chinese Academy of Sciences, 100190, Beijing, China.
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Hu J
Fert Beijing Institute, BDBC, School of Microelectronics, Beihang University, 100191, Beijing, China.
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Wu H
Department of Electrical Engineering, University of California, Los Angeles, CA, 90095, USA.
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Wang H
Fert Beijing Institute, BDBC, School of Microelectronics, Beihang University, 100191, Beijing, China.
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Liu M
Electron Microscopy Laboratory, School of Physics, Peking University, 100871, Beijing, China.
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Liu C
Fert Beijing Institute, BDBC, School of Microelectronics, Beihang University, 100191, Beijing, China.
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Guo C
Beijing National Laboratory for Condensed Matter Physics, Institute of Physics, University of Chinese Academy of Sciences, Chinese Academy of Sciences, 100190, Beijing, China.
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Zhang J
Fert Beijing Institute, BDBC, School of Microelectronics, Beihang University, 100191, Beijing, China.
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Cabero Z MA
Fert Beijing Institute, BDBC, School of Microelectronics, Beihang University, 100191, Beijing, China.
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Zhang Y
Fert Beijing Institute, BDBC, School of Microelectronics, Beihang University, 100191, Beijing, China.
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Gao P
Electron Microscopy Laboratory, School of Physics, Peking University, 100871, Beijing, China.
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Liu S
Shenzhen Institute for Quantum Science and Engineering (SIQSE), and Department of Physics, Southern University of Science and Technology (SUSTech), 518055, Shenzhen, China.
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Yu D
Electron Microscopy Laboratory, School of Physics, Peking University, 100871, Beijing, China.
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Han X
Beijing National Laboratory for Condensed Matter Physics, Institute of Physics, University of Chinese Academy of Sciences, Chinese Academy of Sciences, 100190, Beijing, China.
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Hallsteinsen I
Department of Electronic Systems, Norwegian University of Science and Technology, Trondheim, 7491, Norway.
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Gilbert DA
Material Science and Engineering Department, University of Tennessee, Knoxville, TN, 37996, USA.
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Matsuo M
Kavli Institute for Theoretical Sciences, University of Chinese Academy of Sciences, 100190, Beijing, China.
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Ohnuma Y
Kavli Institute for Theoretical Sciences, University of Chinese Academy of Sciences, 100190, Beijing, China.
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Wölfle P
Institute for Theory of Condensed Matter, Karlsruhe Institute of Technology, 76049, Karlsruhe, Germany.
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Wang KL
Department of Electrical Engineering, University of California, Los Angeles, CA, 90095, USA.
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Ansermet JP
Institute of Physics, Ecole Polytechnique Fédérale de Lausanne (EPFL), 1015, Lausanne, Switzerland.
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Maekawa S
Kavli Institute for Theoretical Sciences, University of Chinese Academy of Sciences, 100190, Beijing, China.
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Yu H
Fert Beijing Institute, BDBC, School of Microelectronics, Beihang University, 100191, Beijing, China. haiming.yu@buaa.edu.cn.
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Published in:
- Nature communications. - 2020
English
An amendment to this paper has been published and can be accessed via a link at the top of the paper.
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https://folia.unifr.ch/global/documents/150971
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