<oai_dc:dc xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:oai_dc="http://www.openarchives.org/OAI/2.0/oai_dc/" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xsi:schemaLocation="http://www.openarchives.org/OAI/2.0/oai_dc/ http://www.openarchives.org/OAI/2.0/oai_dc.xsd">
  <dc:creator>Shi, Xinying</dc:creator>
  <dc:creator>Posysaev, Sergei</dc:creator>
  <dc:creator>Huttula, Marko</dc:creator>
  <dc:creator>Pankratov, Vladimir</dc:creator>
  <dc:creator>Hoszowska, Joanna</dc:creator>
  <dc:creator>Dousse, Jean-Claude</dc:creator>
  <dc:creator>Zeeshan, Faisal</dc:creator>
  <dc:creator>Niu, Yuran</dc:creator>
  <dc:creator>Zakharov, Alexei</dc:creator>
  <dc:creator>Li, Taohai</dc:creator>
  <dc:creator>Miroshnichenko, Olga</dc:creator>
  <dc:creator>Zhang, Meng</dc:creator>
  <dc:creator>Wang, Xiao</dc:creator>
  <dc:creator>Huang, Zhongjia</dc:creator>
  <dc:creator>Saukko, Sami</dc:creator>
  <dc:creator>González, Diego López</dc:creator>
  <dc:creator>Dijken, Sebastiaan van</dc:creator>
  <dc:creator>Alatalo, Matti</dc:creator>
  <dc:creator>Cao, Wei</dc:creator>
  <dc:date>2018-05-01</dc:date>
  <dc:description xmlns:ns0="xml" ns0:lang="en">A critical factor for electronics based on inorganic layered crystals stems from the  electrical contact mode between the semiconducting crystals and the metal  counterparts in the electric circuit. Here, a materials tailoring strategy via  nanocomposite decoration is carried out to reach metallic contact between MoS2  matrix and transition metal nanoparticles. Nickel nanoparticles (NiNPs) are  successfully joined to the sides of a layered MoS2 crystal through gold nanobuffers,  forming semiconducting and magnetic NiNPs@MoS2 complexes. The intrinsic  semiconducting property of MoS2 remains unchanged, and it can be lowered to only  few layers. Chemical bonding of the Ni to the MoS2 host is verified by synchrotron  radiation based photoemission electron microscopy, and further proved by first-  principles calculations. Following the system's band alignment, new electron migration  channels between metal and the semiconducting side contribute to the metallic  contact mechanism, while semiconductor–metal heterojunctions enhance the  photocatalytic ability.</dc:description>
  <dc:format>application/pdf</dc:format>
  <dc:identifier>https://folia.unifr.ch/global/documents/307190</dc:identifier>
  <dc:identifier>https://folia.unifr.ch/documents/307190/files/dou_mcb.pdf</dc:identifier>
  <dc:identifier>https://folia.unifr.ch/documents/307190/files/dou_mcb_sm.pdf</dc:identifier>
  <dc:language>eng</dc:language>
  <dc:relation>info:eu-repo/semantics/altIdentifier/doi/10.1002/smll.201704526</dc:relation>
  <dc:rights>info:eu-repo/semantics/openAccess</dc:rights>
  <dc:rights>License undefined</dc:rights>
  <dc:source>Small. - 2018, vol. 14, no. 22, p. 1704526</dc:source>
  <dc:subject>info:eu-repo/classification/udc/53</dc:subject>
  <dc:title xmlns:ns1="xml" ns1:lang="en">Metallic contact between MoS2 and Ni via Au nanoglue</dc:title>
  <dc:type>http://purl.org/coar/resource_type/c_6501</dc:type>
</oai_dc:dc>
